Équipe Ingénierie de l'Interaction
Humain-Machine

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last update:
23 Oct. 2025

Hongri Gu's publications with EHCI [bibtex|json]

2023

International refereed conference papers

• Modular Tangible User Interfaces: Impact of Module Shape and Bonding Strength on Interaction
  In TEI ’23: Proceedings of the Seventeenth International Conference on Tangible, Embedded, and Embodied Interaction (TEI ’23).
  Pruszko, Gu, Bourgeois, Laurillau, Coutrix